מארז מחשב CoolerMaster HAF 700 EVO

מק"ט:

H700E-IGNN-S00

אחריות:

שנה במעבדה

יצרן:

Unparalleled Hardware & Cooling Capabilities. Mammoth Water Cooling Support. Exclusive Tool-Less Technology. IRIS: Personal LCD Assistant. ARGB Gen2 ready with MasterPlus+ integration.
מפרט
מידע

מפרט

סוג מארז

Full Tower 

תאימות ללוח אם

ATX 
\ Micro ATX 
\ E-ATX 
\ Mini ITX 

ספק כח

ATX (not included) 

Hard Drive 3.5

12 

Hard Drive 2.5

12 

Expansion slots

יציאות קדמיות

Earphone/Mic 
\ USB Type-C 
\ RGB Controller 
\ FAN Controller 
\ USB 3.2 

עיצוב תרמי

Pre-installed Fans - Front 2x SickleFlow PWM Performance Ed. 200mm Pre-installed Fans - Rear 2x SickleFlow PWM ARGB 120mm Pre-installed Fans - Bottom 1x SickleFlow PWM ARGB 120mm 

גובה מקסימלי קירור למעבד (ממ)

160 

מידות

556 x 279 x 540 mm (Body Size), 666 x 291 x 626 mm (incl. Protrusions) (LxWxH) 

פילטר אבק

שליף 

מידע

No Limits.

The HAF 700 EVO is capable of housing up to SSI-EEB motherboards (E-ATX), as well as any sized graphics cards in BOTH horizontal and vertical orientations.

Rotatable Radiator Bracket

Two rotatable radiator/fan brackets included out of the box for showcasing cooling components at unique angles.

Removable Top Panel

The unique removable top panel design allows you to effortlessly install, reach and maintain cooling components such as fans and radiators even in builds with complex custom cooling systems.

Exclusive 200mm SickleFlow PWM Performance Edition

HAF 700 EVO comes with dual exclusive 200mm SickleFlow PWM "Performance Edition" fans tailored to strike a balance between performance potential and noise levels.

Integrated 7x PWM & 5x ARGB Hub

Featuring a fully integrated PWM/ARGB hub for effortless cable management and simplified control over ARGB effects and PWM fan speeds.

ARGB Gen2 Ready, Controller Included

ARGB Gen2 technology allows users to explore full range customization down to the lighting effecting of each individual LED, while remaining compatible with third party devices.

Multi Chamber Layout

HAF 700 EVO’s structure segregates non heat sensitive components so heat dissipation can be targeted towards heat sensitive components at an overall higher efficiency.

השוואה