More than 20 years of experience in server cooling research and development, extraordinary strength
Fins and heat pipes are welded using reflow soldering process
Introduced a new thermal conductivity concept based on the heat generation characteristics of the new platform.
Advantages of multiple heat pipes integration. Excellent heat dissipation performance
Optimize the capillary structure and liquid injection volume inside the heat pipe to achieve perfect liquid-gas conversion in the heat pipe,
and adjust the wide dynamic anti-gravity heat pipe with different ratios
The base is made of finely carved micro-convex pure copper.
The base can fit the CPU more closely under the action of the pressure buckle, and the thermal conductivity is higher.
Selected NMB double ball bearings, ultra-long service life, trouble-free operation and low noise, enjoy a quieter environment
While retaining the main cooling strength, it is compatible with more hardware devices,
adapts to memory below 40mm (memory above 40mm requires pre-installed fans), and adapts to chassis with a radiator height limit of 157mm and above
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