Intel Core i3 3220 With Graphics Tray. The desktop 3rd generation Intel® Core™ processor family is the next generation of 64-bit, multi-core processors built on 22-nanometer process technology.
Intel Core i3 3240 with Graphics Tray - Ivy Bridge (IVB) was Intel's microarchitecture based on the 22 nm process for desktops and servers. For desktop and mobile, Ivy Bridge is branded as 3rd Generation Intel Core processors.
Intel® Core™ i3-4170 Processor 3M Cache 3.70 GHz. These processors are based on Intel® microarchitecture formerly known as Haswell + Lynx Point, manufactured on 22 nm process technology with 3D tri-gate transistors.
These processors are based on Intel® microarchitecture formerly known as Haswell + Lynx Point, manufactured on 22 nm process technology with 3D tri-gate transistors. This platform provides excellent CPU, graphics, media performance, flexibility, and enhanced security over the 3rd generation Intel® Core™ processors, making it ideal for a broad range of intelligent systems.
Ryzen 4000 Series Desktop Processors are built on the industry-leading 7nm process and “Zen 2” core architecture, offering unmatched user experiences and power efficiency in the state-of-the art AMD socket AM4 platform.
The desktop 3rd generation Intel® Core™ processor family is the next generation of 64-bit, multi-core processors built on 22-nanometer process technology. The processors are designed for a two-chip platform. The two-chip platform consists of a processor and a platform controller hub (PCH) and enables higher performance, lower cost, easier validation, and improved x-y footprint. The processor includes integrated display engine, processor graphics, PCI Express* ports, and an integrated memory controller. The processor is designed for desktop platforms. The processor offers either 6 or 16 graphic execution units (EUs). The number of EU engines supported may vary between processor SKUs. The processor is offered in an 1155-land LGA package (H2).
10th Gen Intel® Core™ processors deliver remarkable performance upgrades for improved productivity and stunning entertainment, including up to 5.3 GHz, Intel® Wi-Fi 6 (Gig+), Thunderbolt™ 3 technology, 4K HDR, intelligent system optimization, and more.
The world's most advanced processor in the desktop PC gaming segment Can deliver ultra-fast 100+ FPS performance in the world's most popular games 6 cores and 12 processing threads bundled with the quiet AMD wraith stealth cooler max temps 95°C
The Ryzen 3000 series is built upon a successor architecture to the Zen and Zen Plus cores used in the first and second-generation chips, known as Zen 2. It represents a major overhaul of the design of the CPUs, as well as a die shrinking for certain components. In a similar fashion to AMD’s “Rome” Epyc server CPUs, AMD has split its next-gen chips into “chiplets,” built on TSMC’s 7 nm FinFET process. They contain the CPU cores and are paired with a 12nm input/output (I/O) processor that gives them direct connections to memory, which should reduce the latency concerns that we saw on similar designs with the Zen and Zen Plus-based Threadripper CPUs.
The 6th generation Intel® Core™ processor family is manufactured on Intel's latest 14 nm technology. Paired with the Intel® 100 series chipset, these processors offer dramatically higher CPU and graphics performance as compared to the previous generation, a broad range of power options, and new advanced features to boost performance for edge-to-cloud Internet of Things (IoT) designs. The 6th generation Intel Core processor family maintains a standardized thermal envelope for 65W and 35W desktop products remaining consistent with the previous processor generation and are an ideal low-power option for manufacturing flexibility.
The Ryzen 3000 series is built upon a successor architecture to the Zen and Zen Plus cores used in the first and second-generation chips, known as Zen 2. It represents a major overhaul of the design of the CPUs, as well as a die shrinking for certain components. In a similar fashion to AMD’s “Rome” Epyc server CPUs, AMD has split its next-gen chips into “chiplets,” built on TSMC’s 7 nm FinFET process. They contain the CPU cores and are paired with a 12nm input/output (I/O) processor that gives them direct connections to memory, which should reduce the latency concerns that we saw on similar designs with the Zen and Zen Plus-based Threadripper CPUs.