Includes a register for enhancing clock, command and control signals. Error correction available by added 8 bit parity signals. Supports x4 / x8 Organization / up to 2 ranks per DIMM and 3DPC configuration. Application : Server.
Includes a register for enhancing clock, command and control signals. Error correction available by added 8 bit parity signals. Supports x4 / x8 Organization / up to 2 ranks per DIMM and 3DPC configuration. Application : Server.
Samsung DDR5 96G 4800MHz ECC Reg M321RYGA0BB0-CQK. Includes a register for enhancing clock, command and control signals. Error correction available by added 8 bit parity signals.
This document describes ValueRAM's KVR32N22S8/8 is a 1G x 64-bit (8GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM), 1Rx8, memory module, based on eight 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each 288-pin DIMM uses gold contact fingers.
Unbuffered DIMM DDR5 | No buffer or register: smaller latency value | Supports x8/x16 Organization / up to 2 ranks per DIMM and 2DPC configuration | For Desktop
VENGEANCE LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the eight-layer PCB helps manage heat and provides superior overclocking headroom.
DDR5 meets the demands of industries experiencing an enormous burst in data. A new level of speed, improved capacity, and bolstered reliability are packed into DDR5 to enhance overall system performance. Samsung's memory technology propels the next era of planet-friendly innovation with power-saving DDR5.
Compatible with a wide range of Intel® and AMD® laptops and small-form-factor PCs, VENGEANCE SODIMM upgrades your existing memory, harnessing the faster frequencies and greater capacities of DDR5.
Unbuffered DIMM DDR5 | No buffer or register: smaller latency value | Supports x8/x16 Organization / up to 2 ranks per DIMM and 2DPC configuration | For Desktop
VENGEANCE LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the eight-layer PCB helps manage heat and provides superior overclocking headroom.
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